e r1 v g 1 amp super fast recovery silicon rectifier 1 4 00 volts featur e s for surface mount applications extremely low thermal resistance high temp soldering: 25 0 c for 10 seconds at terminals super fast recovery times for high efficiency gull wing lead bend to prevent arcing perfect for ballast, television and monitor applications maximum ratings operating temperature: - 50 c to +15 0 c storage temperature: - 5 0 c to +15 0 c maximum thermal resistance; 15 c/w junction to lead mcc part number device marking maximum recurrent peak reverse voltage maximum rms voltage maximum dc blocking voltage e r1v g e r1v 1400v 980v 1400v e lectrical characteristics @ 2 5 c unless otherwise specified average forward current i f(av) 1.0a t j = 5 5 c peak forward surge current i fsm 30a 8.3ms, half sine maximum instantaneous forward voltage v f 2. 2 v i fm = 1.0a; t j = 2 5 c* maximum dc reverse current at rated dc blocking voltage i r 5 m a 30 m a t j = 2 5 c t j = 125 c maximum reverse recovery time t rr 1 0 0 ns i f =0.5a, i r =1.0a, i r r =0.25a typical junction capacitance c j 45pf measured at 1.0mhz, v r =4.0v *pulse test: pulse width 200 m sec, duty cycle 2% ww w . mccsemi .com d o - 215aa (smbg) ( r ou n d l ead ) dimensions inches mm dim min max min max note a .075 . 11 6 1.90 2. 95 b .0 7 8 .087 1 . 9 8 2.21 c .00 2 .008 . 05 .20 d --- .02 --- .51 e .015 .03 .38 .76 f .065 .084 1.65 2.13 g .2 4 5 . 2 76 6 .2 2 7 .0 0 h .160 .180 4.06 4.57 j .130 .15 1 3.30 3. 8 3 0.07 0 ? 0.1 90 ? 0. 12 5? suggested solder pad layout g h j e f a b d c cathode band
om p on ent s 21 20 1 i t a sc a s t ree t ch at s w or th ! " # $
% ! " # mcc
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